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Applied research from institutes and universities

skeleton0918Skeleton Technologies conducts intensive research into the use of materials such as graphene as well as cell and module development for ultracapacitor technology. Specifically, for a global player that offers utilities, upgrade and service solutions to utilities, it is currently working on storage solutions that can be used to test power network components.

The vision of the scientists at Citec is technology that "understands". Future machines should be adjusted to humans instead of man on the machine. In exploring the basics of Cognitive Interaction Technology, the cluster does the necessary pioneering work.

TUwien10718Research Report

At the Vienna University of Technology, a special formula for an epoxy resin was developed. It can be used for fiber-reinforced composites in aircraft, automobile or shipbuilding and is even suitable for underwater remediation. Within seconds, the new material can change completely:

TUwien0618At the Vienna University of Technology a special formula for an epoxy resin was developed. It can be used for fiber-reinforced composites in aircraft, automobile or shipbuilding, or even suitable for underwater remediation. Within seconds, the new material can change completely:

Computed tomography has long been limited to smaller and more easily penetrated objects due to the limited power of X-ray sources (450 keV beam energy). The Fraunhofer Institute for Integrated Circuits IIS has now succeeded in removing these restrictions. With the development of a computer tomograph with a linear accelerator as X-ray source with 9 MeV and a correspondingly dimensioned X-ray camera, they have opened up completely new application areas for computed tomography.

Fraunhofer0618Fraunhofer FEP has particular expertise in the development of deposition processes for high-precision coating systems on optical components. Now, for the first time, it has been possible to develop a coating technology for the deposition of laterally graded optical layers on large-area 2D and, in future, also on 3D substrates.

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