Motek Hall 7, 7214 Stand
The high power sensor "Powerpick 3D" from Isra Vision achieves maximum speeds with the "Quad Camera Technology" and empties wire mesh boxes extremely fast. "Minipick 3D, on the other hand, is optimized for components up to a few millimeters in edge length and thus meets even requirements for applications in the fields of precision mechanics, electronics, the toy industry or comparable industries.
These new sensors for fully automatic gripping into the box expand the successful "Intellipick 3D" products, which feature robust component recognition even under the most difficult conditions. With an embedded PC, the design completely dispenses with extensive cabling between camera and PC and can be easily installed and put into operation.
At the same time, the embedded design offers the highest speeds for data transmission. Users benefit from extremely short scan times. The individual conception of the systems focuses on the fastest cycle times, the highest process reliability and maximum timeliness.
Point cloud technology for a look inside
All bin-picking solutions are based on the point cloud technology, which completely captures the objects inside a container. From these initially unstructured information, the various sensors extract the components to be gripped using a CAD template. Since the systems learn new part geometries quickly and easily with the help of a CAD teach-in, the number of detectable components is almost unlimited. They come standard with Wi-Fi and are compatible with all standard communication interfaces and with their flexible mounting system easy to install in any environment.