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The high power sensor "Powerpick 3D" from Isra Vision achieves maximum speeds with the "Quad Camera Technology" and empties wire mesh boxes extremely fast. "Minipick 3D, on the other hand, is optimized for components up to a few millimeters in edge length and thus meets even requirements for applications in the fields of precision mechanics, electronics, the toy industry or comparable industries.

These new sensors for fully automatic gripping into the box expand the successful "Intellipick 3D" products, which feature robust component recognition even under the most difficult conditions. With an embedded PC, the design completely dispenses with extensive cabling between camera and PC and can be easily installed and put into operation.

At the same time, the embedded design offers the highest speeds for data transmission. Users benefit from extremely short scan times. The individual conception of the systems focuses on the fastest cycle times, the highest process reliability and maximum timeliness.

Point cloud technology for a look inside

All bin-picking solutions are based on the point cloud technology, which completely captures the objects inside a container. From these initially unstructured information, the various sensors extract the components to be gripped using a CAD template. Since the systems learn new part geometries quickly and easily with the help of a CAD teach-in, the number of detectable components is almost unlimited. They come standard with Wi-Fi and are compatible with all standard communication interfaces and with their flexible mounting system easy to install in any environment.


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More news from image processing

  • Control machine vision and the solutions of industrial image processing penetrate ever further into industrial areas, where the best image quality, highest resolution and high speeds are required. SVS-Vistek is introducing the new GigE Vision industrial camera SHR461CX from the high-resolution SHR series. With over 100 megapixels, the GigE camera offers an enormous dynamic range of 82 dB. The new rolling shutter sensor IMX461 from Sony also has a resolution of 14.192 x 10.640 pixels and therefore an outstanding image quality.
  • Basler (Sales Rauscher) is expanding its embedded vision offering with two camera modules that are matched to NXP's i.MX 8 processors. With the combination of Basler's camera know-how and the powerful processors from NXP, ideal embedded vision solutions can be implemented for industrial applications.
  • Qioptiq is expanding its quartz lenses "Linos F-Theta Ronar" with a new telecentric version for the green spectrum (515 - 540 nm). The Excelitas subsidiary developed this laser lens especially for micro material processing. Other fields of application are laser structuring as well as laser welding and cutting.
  • With the “Rapixo CXP”, Matrox Imaging (Sales Rauscher) has developed a new frame grabber generation for version 2.0 of the Coaxpress (CXP) interface standard. With it - also downward compatible to Coaxpress 1.0 / 1.1 - data rates of up to 6,25 Gbit / s (CXP-6) or up to 12,5 Gbit / s (CXP-12) can be achieved.
  • SPS Hall 4A, Booth 126 When measuring temperatures in processes using lasers, the infrared camera must be insensitive to the stray light from the laser. The new "PI 08M" from Optris is ideally suited for such applications because it has a very narrow-band spectral sensitivity at 800 nm.
  • With the Basler Boost, Basler (Sales Rauscher) is expanding its portfolio with cameras with the Coaxpress 2.0 standard and modern CMOS sensor technology. The "Boost Bundle" consists of a Boost camera, the matching CXP-12 interface card and the CXP-12 accessory starter kit for a time-saving and cost-saving evaluation phase.
  • The "NIT Widy Sens SWIR" cameras with dual-mode "InGaAs" sensors from Rauscher offer a compromise between high sensitivity due to linear response and high dynamics at 120 dB with logarithmic response. 230 frames / s and synchronous image acquisition in the ns range are further features of the camera.
  • The Basler "Blaze" 3D camera with GigE interface and VGA resolution (sales by Rauscher) is suitable for determining the position, position and volume of objects and for detecting obstacles thanks to Sony Depthsense ToF technology. The industrial 3D camera works on the basis of the time-of-flight principle.
  • The "Scenesan Pro" real-time stereo vision system from Nerian (sales Rauscher) can now also evaluate input images with a resolution of up to 6 megapixels. The dedicated image processing system calculates depth information from stereoscopic image data.
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