Industry up to date

Clever connection technology for your production

telsonic0918Fakuma Hall A4, Booth 4112

Telsonic introduces the new control software "Telsoflex" with new 12 "touch panel for ultrasonic welding and separating welding, which makes the ultrasonic systems of the USP and TSP series fit for the 4.0 industry.

viscotec10818Bond Expo Hall 6 stand 6419

Success Story

The Fichter Maschinen GmbH designed for IFM Ecomatic in Kressbronn, a facility that can perform various joining and dosing operations. It consists of two dosing stations and a joining station. The dosing stations are each with a 2K dispenser and a "Viscotreat-R" storage container from Viscotec pump u. dosing equipped.

viscotec20818Bond Expo Hall 6 stand 6419

To meet the high challenges of the automotive industry, one had to PreeflowCustomers optimize their application when applying an 2K sealant within a specified range. By working with the Viscotec Branch in Singapore, the production process in the field of dosing technology has been significantly optimized.

viscotec0718Franklin Electric's Czech production site needed to streamline dosing processes to save material and create clean jobs. The Preeflow Dispenser of Viscotec helped to implement the requirements.

ejot0718In addition to many other existing lightweight construction materials in the market, in particular the foamed thermoplastics produced by means of "Mucell" processes are becoming increasingly popular for lightweight construction solutions. For this difficult application has Ejot The "Cell PT" screw is a particularly powerful connecting element.

rampf0518With "Raku PUR 33-1034"Opened Rampf Polymer Solutions completely new ways in LED production. Because the foamed adhesive stands for gluing and sealing in a product and is therefore perfect for modern LED lights that are tightly closed.

Current trade fair specials

FMB

Subcontractor Maschinenbau Bad Salzuflen: 7. to 9. November 2018
The international trade fair for plastics processing, Friedrichshafen: 16. to 20. October 2018
World's leading trade fair for components, systems and applications of electronics in Munich: 13. to 6. November 2018

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