Hannover Messe Hall 13, Stand E97
In enclosures that are exposed to large temperature fluctuations, harmful condensation may form or pressure may build up which stresses the housing seals used. The result: Components are damaged and contaminants can penetrate. The new pressure compensation elements (DAE) of Pflitsch can effectively prevent this:
Electronica Hall A2, Booth 343
Rolec presents the design housing "Technodisc", which is designed with its round shape, especially for the field of vision in the industry. While the already introduced housing "Aludisc" consists of aluminum, Technodisc is made of the high-quality plastic Luran.
SPS IPC Drives Hall 3C, Stand 430
Rittal presents his new one VX25 as the first control cabinet system fully developed along the requirements for increased productivity and those of Industry 4.0. A significant increase in productivity is predicted by integrated solutions with software tools and data as well as the new wire terminal for fully automatic wire packaging.
Electronica Hall A2, Booth 500
Bopla offers a variety of electronics enclosures and services that are tailored to the exact requirements of industrial 4.0 applications. The focus is on the "Bolink "-Sensorgeh√§use as well as the integration of touch screens and displays into various housings.