Industry up to date

Communication building blocks for the networked factory

Turck0519With the IM12interface devices the advantages of the IMX12 family of Turck now for the first time also for applications with non-intrinsically safe signals use. The IM12 are among the narrowest devices on the market and save space in the control cabinet with only 6 mm width per channel.

Harting0519Train travelers now expect high-performance Internet access: They want to surf privately during the train journey or use the compartment as a mobile workstation. The railway operators must therefore offer an appropriate data infrastructure to meet the increasing customer requirements. This requires new cabling systems. Harting has for the traffic engineering Solutions developed.

Harting0419The Harting Technology Group Cooperates with TE Connectivity (TE), a world leader in connectivity and sensor technology. Together, both partners want to advance Single Pair Ethernet (SPE) as the de facto infrastructure solution for the Industrial Internet of Things (IIoT). The two companies want to develop solutions for the SPE infrastructure.

Hannover Messe Hall 9, as F62

From the sensor or actuator to every cloud in less than a minute, where previously complex integration projects took several weeks or even months to complete: Cloudrail Licobo introduces its new plug-and-play promise Cloudrail.Box for IO-Link-capable sensors and actuators.

phoenic0319Hannover Messe Hall 9, as F40

The companies Phoenix Contact, Weidm├╝ller Interface, Reichle + Massari (R + M), Belden and Fluke Networks announce a technology partnership for Single Pair Ethernet (SPE). The companies develop and support IEC-63171-2 (office environment) and IEC 63171-5 (industrial environment) plug-in faces, which are jointly introduced in the standardization.

turck0319Hannover Messe Hall 9, Stand H55

The Simple IO-Link device integration from Turck short SIDI, simplifies the handling of IO-Link devices in Profinet engineering systems. Since the devices are already integrated in the GSDML file of the master, the user can select the devices from the device library (for example in the TIA Portal) and integrate them via drop-down fields in his project, as if the devices were submodules on a modular I / O system.

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